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Problems And Countermeasures Of Diamond Tools In The Process Of Optical Glass Processing
Dec 05, 2018

Diamond tools often have various problems during use, which affect the yield and efficiency of processing, and have a great impact on production costs and product performance. This is mainly reflected in the manufacturing technology and intrinsic performance of diamond tools.

Milling process

The following major problems often occur during milling:

(1) bad roughness

(2) hitting glass and crashing

(3) Profile instability

(4) Low efficiency, deep scratches

These problems are mainly related to the particle size, concentricity, concentration of the grinding wheel, the self-sharpness of the bonding agent and the life and durability of the grinding wheel. Solving these problems is analyzed from the manufacturing technology of the grinding wheel, mainly adjusting the strength and diamond concentration of the bonding agent. And the particle size, and the concentricity of the grinding wheel must be guaranteed. Mainly to improve the holding strength of the diamond and reduce the grinding hardness of the bonding agent.

Fine grinding and super finishing and polishing processes

Fine grinding, super-finishing and polishing processes are the most critical processes for optical glass processing, and are the most prone to quality problems. The diamond tools in this process are also the most difficult to make. The problems that are easy to occur in this process are as follows:

(1) The workpiece is prone to pitting

(2) Aperture instability and irregular aperture

(3) poor surface roughness

(4) The workpiece is broken or collapsed

(5) Regular scratches or irregular scratches

(6) The grinding disc is easy to passivate

(7) Low cutting efficiency

Most of these problems are related to the quality of diamond tools and should be improved from the following aspects:

(1) Select a suitable diamond concentration, which is generally higher than the diamond concentration.

(2) Improve the self-sharpness of the bonding agent, mainly to reduce the grinding hardness and uniformity, and to reduce the segregation of low-melt.

(3) Reduce the coverage ratio of the diamond sheet, reduce the grinding surface area of the diamond pellet, or increase the chip space.

(4) Reducing the dispersion of the diamond particle size and the irregularity of the shape. Never allow large particles, and do not allow more fine particles.

(5) The quasi-nanoscale trace elements are added to the binder to change the properties of the binder.

(6) Add a small amount of fine particle abrasive to the grinding fluid.

(7) Improve the water resistance and temperature resistance of the resin and improve its thermal conductivity.

(8) Lowering the pores in the pellet and reducing the crystal size of the binder.