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TEL: +86-020-31105688
E-mail: info@jrdiamondtools.com
Address: Building C28, Huachuang Industrial Park, Jinshan Avenue, Shiji Town, Panyu, Guangzhou 511450, China

Silicon Wafer Back Grinding Wheels for Thinning and Fine Grinding

Sapphire Wafer Back Grinding Wheels are mainly used for the thinning and fine grinding of the silicon wafer. The Grinding-wheels for LED Substrate, Silicon Wafer, Sapphire Wafer are mainly used for Back Thinning of Sapphire Epitaxial Wafer, Silicon Wafer, Gallium Arsenide and GaN Wafer. Enable...

  • Features & Specification


    Silicon Wafer back grinding wheels for thinning and fine grinding


    wafer back grinding wheel Specifications: 

    Shape

    D

    H

    T

    W

    X


    150

    12

    28

    15

    6


    250

    46

    28

    12

    10


    302

    35

    110

    7

    9

    wafer back grinding wheel Application: silicon wafer back thinning,sappire lapping,wafer back grinding and Fine Grinding 

    Sapphire Wafer Back Grinding Wheels are mainly used for wafer thinning and fine grinding . The Grinding-wheels for LED Substrate, Silicon Wafer, Sapphire Wafer are mainly used for Back Thinning of Sapphire Epitaxial Wafer, Silicon Wafer, Gallium Arsenide and GaN Wafer.

    Enable the cost saving process by the efficient work. Appropriate Grinding-wheel for surface grinding which provides the high efficient and accurate work. The excellent sharpness and accurate working of the porosity Vitrified Bond together with special segment configuration maximize its performance.

    The Workpiece Processed: Sapphire Epitaxial Wafer, Silicon Wafer, Gallium Arsenide and GaN Wafer.

    Material of Workpiece: Synthetic Sapphire, Single Crystal Silicon, Gallium Arsenide and GaN materials.

    Application process: back thinning, front grinding coarse grinding and lapping processing.

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    The Features :
    1
    Various directions of producing chemicals or metallurgical products. Provide with high efficiency of grinding and durable lifetime.

    2) Stable manufactures technics. Provide with fine roughness of wafer surface.
    3) Back Grinding wheel is the precision processing tool used in the process to grind unnecessary wafer back side and make the wafer back side with excellent backside roughness and uniform thickness, high technology is required to minimize wafer defect whose material is expensive and easy to be broken.

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    Company information 

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     JR Diamond Tools Co., Ltd. was established in 1992. As a professional manufacturer of diamond tools in China, we supply extensive high-quality diamond tools in the industries of stone, glass, electronic industry, construction, beauty and healthy, and crystal.

     Our products Vitrified diamond & CBN tools , resin diamond & CBN tools ,diamond tools for stones , diamond tools for glasses, electroplated diamond & CBN tools , high precision and superthin cutting wheels , diamond abrasive, diamond tools for gems, etc.

     Our R&D team Eight engineers persist in improving our product quality and reducing the costs of our diamond tools. 
     OEM service Your design also can be finished. 
     Constant quality All the production procedures accord with the quality control system of ISO9001. 
     The best price Raw materials made by ourselves, effective management and cheaper labor force ensure us to reduce our costs of diamond tools. 
     Fast lead time Most of our products have stock , we will arrange the shipment 3-15 work days after your confirmation. 
     After sales service Technical consultation at any time and one-year warranty for all products.


    Welcome to place orders for the silicon wafer back grinding wheels for thinning and fine grinding with our factory. As one of the leading manufacturers and suppliers in China, we can assure you that all products are made in strict accordance with ISO9001 in China. For customized orders, please inform us in advance.

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